Diamond Cutting
Laser Diamond Cutting
DPL Application In Laser Cutting&Sawing
Introduction To Diamond Cutting
Diamonds are the most precious and beloved of all. Before being used as industrial or decorative diamonds, the original rough stones are classified according to their natural properties such as form, size, color, quality, etc., and undergo a series of designs and processes to become the final product.
Although there were germs that changed the design and equipment of diamond processing techniques as early as the early 17th century, ancient processing techniques were still in use until the early 21st century. It was only the advent of a new era in laser technology that the future of the diamond industry was changed and reshaped around the world. Einstein established the theoretical basis of laser technology in 1917, and in 1906 Theodore H. Maiman demonstrated the world’s first functional laser, so that lasers were gradually widely used in various industries.
Challenge In Diamond Cutting & Sawing
Since diamond is a hard and brittle material with high chemical stability, it has been a challenge to perform the cutting process. Traditional chemical cutting processing or physical polishing may cause insurmountable problems, high labor operation costs, and error rates. Traditional mechanical processing and polishing of diamonds is prone to cracks, chips, delamination, and edge breakage. In another aspect, there would be great wear and tear on the diamond-polishing tools. Since there is an extremely high requirement for cutting accuracy, which is calculated at the micron level, this is a very strict test for the diamond-cutting process.
In view of the above problems, laser cutting technology is a new solution, which can cut diamonds at high speed and high quality, and has advantages in cutting hard and brittle materials. Laser cutting has a low thermal impact and is less likely to damage the diamonds during the process. Also, it has lower possibility cause cracks, chipping, ripples, and other defects, ensuring efficient processing. In terms of production efficiency, this method has a fast processing speed, low equipment cost, and less error rate than manual polishing. The highest demands are placed on what is the core component of a diamond-cutting machine: the Laser light source. Lumispot Tech has a QCW diode pump module (QCW DPL) with a high energy density and a better beam quality, which is a clear advantage compared to other lasers.
Lumispot Tech offers a customizable service for QCW DPL, which can be customized for pumping power, crystal size, and Nd:YAG doping concentration. If there is any other question refer to the QCW DPL, please leave a message to us, we’d love to help you with that.